?product?number:?614-99-304-31-002000 description: dip carrier plastic carrier with ultra low profile receptacles open frame accepts .015-.022" leads plating?code: 99 shell?plating: 200 " tin/lead(93/7) over 100 " nickel inner?contact?plating: 100 " tin/lead(93/7) over 50 " nickel packaging: packaged in tubes # of pins a b c qty. per tube mill-max part number rohs compliant 4 0.200 0.300 0.400 102 614- 99 -304-31-002000 ?contact: contact used: #11, standard 3 finger contact current?rating?= 3 amps beryllium?copper?alloy 172 (uns c17200) per astm b 194 properties?of?beryllium?copper: chemical composition: cu 98.1%, be 1.9% temper as stamped: td01 properties after heat treatment (th01): hardness: 36-43 rockwell c mechanical life: 100 cycles min. density: .298 lbs/in3 electrical conductivity: 22% iacs* resistance: 10 miliohms max operating temperature: -55c/+125c melting point: 980c/865c (liquidus/solidus) stress relaxation?: 96% of stress remains after 1,000 hours @ 100 c ; 70% of stress remains after 1,000 hours @ 200 c *international annealed copper standard, i.e. as a % of pure copper. ?since becu loses its spring properties over time at high temperatures; it is rated for continuous use up to 150c. for applications up to 300c, mill-max offers many contacts in beryllium nickel. contact tech support for more info. ?loose?pin: pin used: 0442 (brass alloy) mill-max mfg. corp. datasheet ? last modified 2/5/2009 page 1 of 2
brass?alloy (uns c36000) per astm b 16 properties?of?brass?alloy: chemical composition: cu 61.5%, zn 35.4%, pb 3.1%? hardness as machined: 80-90 rockwell b density: .307 lbs/in3 electrical conductivity: 26% iacs* melting point: 900c/885c (liquidus/solidus) ?(3 to 4% lead is used to permit "free machining" and is permitted by ec directive 2002/95annex 6; so all pin materials are rohs compliant) *international annealed copper standard, i.e. as a % of pure copper. ?insulator?information: pct polyester, (thermx cg933, black) high temperature properties?of?pct?polyester: brand: thermx grade: cg-933 rated voltage: 100 vrms/150 vdc insulation resistance: 10,000 megaohms min. material heat deflection temp (per astm d 648): 529f (276c) @ 66 psi dielectric strength: 1000 vrms min. (700 vrms min. for series 117 shrink dip) note: materials above 446f (230c) are considered suitable for "eutectic" reflow soldering, above 500f (260c) for "lead-free" reflow soldering. mill-max mfg. corp. datasheet ? last modified 2/5/2009 page 2 of 2
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